PIF2024 - Flexible devices based on 2D semiconductor for low-cost IoT and Industry 4.0 sensors (FLEX2D) (PID2023-151946OB-I00)

The main goal of the FLEX2D project is to pave a new avenue in flexible electronics by harnessing the potential of van der Waals semiconductors, integrated with flexible supports. Employing an innovative high-throughput mechanical exfoliation technique, the project aims to produce large-area films composed of interconnected flakes at a fraction of the traditional cost of other high-performing large-area growth methods, while maintaining exceptional electronic properties comparable to those of individual flakes. The primary focus is on the utilization of these films to fabricate a variety of electronic components, including transistors and phototransistors, which will further be integrated into more complex systems such as logic circuits and basic camera sensors. Specific objectives: High-throughput exfoliation technique development: Further optimization of the high-throughput mechanical exfoliation technique for the cost-effective production of large-area films of different van der Waals semiconductors, insulators and conductors that could be used as building blocks of the electronic devices. The exfoliation and transfer technique will be further developed to improve scalability and reproducibility. Development specific flexible electronics fabrication protocols: Develop fabrication protocols for building electronic devices from transferred van der Waals films. This involves multi-step transfers of films for different device parts or the creation of micro-fabrica